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| STPS61L45C Power Schottky rectifier Features A1 High current capability Avalanche rated Low forward voltage drop current High frequency operation K K A2 Description Dual center tap schottky rectifier suited for high frequency switch mode power supplies. Packaged in TO-247 and TO-220AB, this device provides desktop SMPS designers with a low forward voltage drop device, and reduced leakage current, with the objective of making the application compliant with environmental care standards, or suitable for 80+ requirements. A1 K A2 K A1 A2 TO-220AB STPS61L45CT TO-247 STPS61L45CW Table 1. Device summary IF(AV) VRRM Tj (max) VF(typ) 2 x 30 A 45 V 150 C 0.45 V November 2007 Rev 1 1/8 www.st.com 8 Characteristics STPS61L45C 1 Characteristics Table 2. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj 1. dPtot --------------dTj Absolute ratings (limiting values per diode at 25 C unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current = 0.5 Tc = 120 C Tc = 115 C Per diode Per device Value 45 60 30 60 500 10000 -65 to + 175 (1) Unit V A A A W C C Surge non repetitive forward current tp = 10 ms sinusoidal Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature < 1 ------------------------Rth ( j - a ) tp = 1 s Tj = 25 C 150 condition to avoid runaway for a diode on its own heatsink Table 3. Symbol Rth(j-c) Rth(c) Thermal resistances Parameter Junction to case Coupling Per diode Total Value 1.3 0.75 0.2 Unit C/W C/W When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c). Table 4. Symbol IR(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C VR = VRRM Min. Typ. Max. 1.5 mA 190 0.35 IF = 5 A 0.23 0.43 IF = 15 A 0.34 0.50 IF = 30 A 0.45 0.50 V 0.40 0.56 0.51 400 Unit VF(2) Forward voltage drop Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.3 x IF(AV) + 0.007 x IF2(RMS) 2/8 STPS61L45C Characteristics Figure 1. Conduction losses versus average Figure 2. forward current (per diode) IF(av)(A) =0.05 =0.1 =0.2 =0.5 =1 Average forward current versus ambient temperature ( = 0.5), (per diode) PF(av)(W) 25 35 30 Rth(j-a)=Rth(j-c) 20 25 15 20 15 10 Rth(j-a)=10C/W 10 T T 5 IF(av) (A) 0 0 5 10 15 20 25 30 5 =tp/T 35 tp =tp/T 0 25 tp Tamb(C) 50 75 100 125 150 0 40 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1 s) 1 1.2 1 PARM(Tj) PARM(25 C) 0.1 0.8 0.6 0.4 0.2 0.01 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (per diode) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration 300 IM(A) 1.0 0.9 Zth(j-c)/Rth(j-c) TO-247 250 0.8 0.7 0.6 200 TC=25C 150 0.5 0.4 0.3 T TC=75C 100 TC=125C 50 IM t 0.2 0.1 0.0 Single pulse =0.5 t(s) 1.E-02 1.E-01 1.E+00 tp(s) 1.E-02 1.E-01 =tp/T tp 0 1.E-03 1.E-03 1.E+00 3/8 Characteristics STPS61L45C Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode) Tj=150C Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) 1.E+03 IR(mA) 10.00 C(nF) F=1MHz VOSC=30mVRMS Tj=25C 1.E+02 Tj=125C Tj=100C 1.E+01 Tj=75C 1.00 1.E+00 Tj=50C Tj=25C 1.E-01 1.E-02 0 5 10 15 20 VR(V) 0.10 VR(V) 30 35 40 45 1 10 100 25 Figure 9. IFM(A) Forward voltage drop versus forward current (per diode) 200 180 160 140 120 100 80 60 40 20 0 Tj=125C (Maximum values) Tj=25C (Maximum values) Tj=125C (Typical values) VFM(V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 4/8 STPS61L45C Package information 2 Package information Epoxy meets UL94, V0 Cooling method: C Recommended torque values for: TO-220AB 0.4 to 0.6 N*m Recommended torque values for: TO-247 0.9 to 1.2 N*m In order to meet environmental requirements, ST (also) offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are Lead-free. The category of second level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 5. TO-220AB dimensions Dimensions Ref. Millimeters Min. A C H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ 0.511 0.104 0.600 0.244 0.137 0.102 typ. 0.147 0.151 0.055 0.069 0.126 2.6 typ. 3.75 3.85 5/8 Package information Table 6. TO-247 dimensions STPS61L45C Dimensions Ref. Millimeters Min. A D V Inches Min. 0.191 0.086 0.015 0.039 Max. 0.203 0.102 0.031 0.055 Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 E Dia V F F1 3.00 typ. 2.00 typ. 2.00 3.00 2.40 3.40 0.118 typ. 0.078 typ. 0.078 0.118 0.094 0.133 H A F2 F3 L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1 F4 G H L L1 L2 L3 L4 L5 M V V2 Dia. 10.90 typ. 15.45 19.85 3.70 15.75 20.15 4.30 0.429 typ. 0.608 0.781 0.145 0.620 0.793 0.169 18.50 typ. 14.20 14.80 0.728 typ. 0.559 0.582 34.60 typ. 5.50 typ. 2.00 3.00 1.362 typ. 0.216 typ. 0.078 0.118 5 typ. 60 typ. 3.55 3.65 5 typ. 60 typ. 0.139 0.143 6/8 STPS61L45C Ordering information 3 Ordering information Table 7. Ordering information Marking STPS61L45CW STPS61L45CT Package TO-247 TO-220AB Weight 4.4 g 2.2 g Base qty 30 50 Delivery mode Tube Tube Order code STPS61L45CW STPS61L45CT 4 Revision history Table 8. Date 14-Nov-2007 Document revision history Revision 1 Initial release Description of changes 7/8 STPS61L45C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 |
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